Information about the contemplated issuance of convertible debt
Company news
2025-02-17 17:01:06
Reference is made to the N-OTC announcement published by CondAlign AS on 7 February 2025 regarding that Condalign need to secure additional funding to finance the current business to facilitate continued strategic discussions.
CondAlign has initiated an application period for a convertible loan to raise a minimum of NOK 9,000,000. The convertible loan can be converted into units of shares in the existing share classes of preference shares and ordinary shares at a conversion price of NOK 8 per unit. Each unit includes 1 preference share and 50 ordinary shares. The convertible loan will be contingent upon approval by an extraordinary general meeting of the Company.
The transaction is directed at 1) existing shareholders in the Company as of 4 February 2025, as registered in the VPS on 6 February 2025, in reliance on applicable prospectus exemptions who have not expressly informed the Company that they will not subscribe for the convertible loan (“Tranche 1”); 2) an institutional offering directed towards qualified investors in accordance with applicable prospectus exemptions (“Tranche 2”); and 3) existing and former employees and board members of the Company in reliance on applicable prospectus exemptions, expired at 17:00 hours CET on 17 February 2025.
The minimum amount of NOK 9,000,000 have been met within the end of the subscription period, but the board of directors of CondAlign have resolved to extend the application period until 16:00 hours CET on 21 February 2025 to further increase the amount
Coming soon: New product from CondAlign!
TIM-Align100 is a 100 µm thick thermal transfer tape, ideal to bond heat sinks to electronic components such as CPUs, GPUs, LEDs and other heat generating components. The tape helps to transfer the heat generated by the components to the heat sink more efficiently, thereby improving the performance and reliability of the electronic device.
TIM-Align100 is produced with the same technology as our E-Align products range and is therefore a very cost competitive and sustainable alternative to comparable products. This technology allows for excellent performances with very low filler contents. The TIM-Align100 shows a thermal impedance close to 1 K cm²/W, with a thermal conductivity at 1 W/m K, which is exceptionally good for a thermal transfer tape.
Using thermal tape has several advantages over other types of thermal interface materials such as thermal paste or thermal grease. Some of the benefits are:
Easy to apply: There is no need for special equipment or tools. It is as simple as peeling off the backing and pressing the tape onto the surface.