Trakk ordren min i thin film og fikk funcom pÄ 1.20 istede, beklager at eg gav utrykk for kjÞp, neste gang eg legger ut kommentar skal det gjÞres 'etter kjÞp. Litt dumt av meg fÞles det som. BÄde kommentaren og kjÞpet, eg burde jo ta ned risikoen litt da eg har alt i funcom. Men fikk ned snittet i fc litt sÄ helt forgjeves var det ikkje.
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Mulig jeg er seint ute med denne, men ser at Edison har oppdatert sin analyse av Thin Film Electronics den 24.11.2016. Se analysen her: http://www.stockfiltr.com/o/link/?id=36909&cid=302
Ser ogsÄ administrerende er i et intervju. Ikke sÄ mye nytt, men alltid interessant Ä hÞre Davor sin take:
"Weâre trying to solve tasks that are obviously solvable with semiconductors. But we can do it in a way that makes it scalable and cheap enough to be used in billions of places. If you need processing power, youâll use semiconductors. But if you have simple tasks for billions of cases, you can use printed electronics," he says.
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Da har jeg sÄ vidt begynte Ä fylle pÄ i Thin Film igjen. Kommer til Ä fylle pÄ mer hvis den skulle finne pÄ Ä duppe. PÄ tide Ä tenke tungt i denne aksjen igjen, for neste Är skjer det nok en del for dette selskapet 
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http://www.newsweb.no/newsweb/search.do?messageId=415115
THIN - CONTEMPLATED PRIVATE PLACEMENT
Oslo, 1 December 2016
Thin Film Electronics ASA (âThinfilmâ or the âCompanyâ) has retained ABG Sundal
Collier ASA and Arctic Securities AS as Joint-Lead Managers and Joint
Bookrunners (the âManagersâ) to advise on and effect an undocumented private
placement of up to the NOK equivalent of approximately USD 60 million,
representing approximately 20% of the outstanding shares in the Company (the
"Private Placement"). The subscription price in the Private Placement will be
set at or close to market through an accelerated bookbuilding process.
The Company has received significant pre-commitments from existing shareholders,
as well as new institutional investors, to subscribe for shares in the Private
Placement.
The application period for the Private Placement commences today at 16:30 CET
and closes 2 December 2016 at 08:00 CET. The Company and the Managers may,
however, at any time resolve to close or extend the bookbuilding period at their
sole discretion and on short notice. The minimum subscription amount in the
Private Placement will be NOK 2 million.
The net proceeds from the New Share Issue will be used to prepare and equip
Thinfilmâs newly leased manufacturing site at Junction Road, North San Jose,
California in order to achieve an expected production capacity of five billion
NFC units. A portion of the proceeds will also cover operating costs during
2017 and 2018. Additional funds may be necessary to achieve break-even, and
such sufficient additional funding may be provided through a number of
alternatives, including strategic partnerships, customer financing, and/or
exercise of existing warrants previously issued by the company.
The Private Placement will be divided into a Tranche 1 consisting of 67,600,000
new shares (representing approximately 10% of the share capital of the Company)
(the âTranche 1 Sharesâ) and a Tranche 2 consisting of an equal number of new
shares (the âTranche 2 Sharesâ). The completion of Tranche 1 of the Private
Placement is subject to approval by the Board of Directors pursuant to an
authorisation by the Companyâs general meeting held 10 May 2016, while the
completion of the potential Tranche 2 of the Private Placement is subject to the
approval by an extraordinary general meeting (the âEGMâ) expected to be held on
or about 23 December 2016.
The Private Placement will be directed towards Norwegian investors and
international institutional investors, in each case subject to and in compliance
with applicable exemptions from relevant prospectus or registration
requirements. The private placement structure of the transaction will inherently
require a waiver of existing shareholdersâ preferential rights to subscribe for
new shares. The Board of Directors considers such structure and waiver necessary
and appropriate in the interest of time and successful completion.
Notification of allotment and payment instructions for Tranche 1 is expected to
be sent to the applicants by the Managers on or about 2 December 2016. In order
to provide for prompt registration of the share capital increase, the Company
and the Managers expect to enter into an agreement related to pre-funding of the
payment for the shares allocated in Tranche 1 of the Private Placement, such
agreement regulating inter alia certain rights and obligations of the Company
and the Managers related to the pre-funding. Subject to such agreement being in
place, settlement of Tranche 1 is expected to take place on 6 December 2016 (on
a regular DVP, t+2 basis).
Notification of conditional allotment and payment instructions for Tranche 2 is
expected to be sent to the relevant applicants by the Managers on or about 2
December 2016. Settlement of Tranche 2 is expected to take place shortly after
the EGM, subject to the approval by the Norwegian Financial Supervisory
Authority of a listing prospectus for the Tranche 2 Shares (the âProspectusâ).
If the Prospectus is not approved at that point in time, the Tranche 2 Shares
may be issued on a separate ISIN and subsequently delivered to the relevant
applicants. These shares would thereafter be converted to the existing ISIN of
Thinfilm and become tradable on the Oslo Stock Exchange as soon as practically
possible following the approval of the Prospectus by the Norwegian Financial
Supervisory Authority.
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Blir vel opp dette? Bare 10% utvanning i bytte mot fullt operasjonell fabrikk med kapasitet til 5 milliarder brikker.
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http://www.newsweb.no/newsweb/search.do?messageId=415130
The Company announces today that it has raised NOK 529 million in gross proceeds
through a private placement consisting of 135,200,000 new shares (the âPrivate
Placementâ). The subscription price in the Private Placement has been set to NOK
3.91 per share, equivalent to the closing price on the Oslo Stock Exchange
yesterday.
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Blir bittelitt mer interessert nÄ merker jeg.
Jeg forstÄr ikke helt hvordan dette selskapet har tenkt Ä tjene penger? De selger NFC-brikker som klistrelapper til noen Þre per stk. og sender ut bÞrsmeldinger om de fÄr en avtale pÄ 100 000kr ? Dette mÄ da vÊre REC all over again og hvorfor i all verden skal ikke Kina dominere dette markedet om fÄ Är?
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Disse pengene skal gÄ til Ä fÄ fabrikken opp i en produksjonskapasitet pÄ 5 milliarder stk. Glad jeg gikk inn igjen nÄ. Tror timingen er god.
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Fikk 10k pÄ 3.98
Jeg kom meg inn igjen pÄ 3.87, sÄ fÄr man se om man fÄr fisket lavere enn det fremover.
http://www.newsweb.no/newsweb/search.do?messageId=415450
Thin Film Electronics ASA (âThinfilmâ) issues this notice on behalf of Woodford Investment Management LLP (âWoodfordâ), acting as agent for and on behalf of funds under its management.
Following the share capital increase in Thinfilm, registered 5 December 2016, the holdings of Woodford have passed below 20 percent of the share capital and voting rights in Thinfilm. Woodford has a combined holding of 142,187,950 shares, which represents 19.1 percent of the issued share capital and votes in Thinfilm. In addition, Woodford holds 40,000,000 warrants.
Fylte pÄ litt her idag Tror vi vil se en hÞyere kurs over nyÄret og mot sommeren. Kan komme en melding om en stÞrre ordre nÄr som helst fÞler jeg, da er det greit Ä vÊre inne.
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KjĂžpte mer her idag, klart Ă„ dra ned snittet mitt til 3.80 blank.
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Currently, ThinFilm specializes in printed electronics in the form of smart labels for perishable products (such as food), non-volatile printed memory, and near field communication.
To meet the expected demand for the integration of electronics, the company purchased a manufacturing facility in Silicon Valley which it will retrofit to produce some five billion printed devices that are estimated to have a value of $680 million.
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http://www.newsweb.no/newsweb/search.do?messageId=416496
Thinfilm to Demonstrate âSmart Beerâ and âSmart Medical Devicesâ at CES 2017
OSLO, Norway, December 20, 2016 - Thin Film Electronics ASA (âThinfilmâ), a global leader in NFC (near field communication) smart-packaging solutions using printed electronics, will demonstrate its innovative technology at CES in Las Vegas, January 5-8, 2017. In addition, Erwan Le Roy, Thinfilmâs EVP Business Development & GM NFC Solutions and Smart Sensor Products, will deliver a presentation on Thinfilmâs NFC mobile marketing solutions and the critical role they can play in expanding the Internet of Things (IoT).